Embedded systems are increasingly coming under attack as they hook up to the internet. Coding standards have emerged that make it easier to build code that is secure from the bottom up.
2.5D-IC integration overcomes 2D limitations such as cost, offchip bandwidth bottlenecks and I/O pin scarcity, and offers a route to true 3D-IC integration.
It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
An increasingly important concept in design is that of product creation. An approach based on product creation looks beyond chip or board design.
The chipmaker used Calypto’s PowerPro to carry out power analysis of its latest core design at the RTL rather than at post-gate synthesis.
Debug of logic and testbench debug makes up 35% of chip design, and is growing as power-management and hardware/software issues become part of the task.
You can waive some physical verification errors related to legacy IP found in foundry DRC checks. Knowing which has involved lengthy manual analysis. TSMC is enhancing the process with automation.
The multiple clock domains on today's SoCs create a hotbed for clock-domain crossing bugs to thrive. Low-power design techniques increase the complexity of tracking these bugs down. Find out how these failures arise and what to do about them.
Now companies in any tier can use development kits as a platform to speed development, bridge the hardware-software divide and build out ecosystems quickly.
The technique drove ‘agile systems development’ for the programmable logic vendor’s new product line.
View All Sponsors