Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
June 5, 2013

FinFET processes demand delicate tradeoffs for mobile SoCs – GlobalFoundries process architect

The increasing use of graphics in mobile SoCs means that finFET processes need to be optimised for density and power – as well as early availability at low risk.

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June 5, 2013

Jasper, Duolog bring formal verification to IP specification and assembly, low-power design

Deal creates methodologies and tools to help deliver IP and SoC assemblies verified using formal methods. Low-power verification strategy also launched.

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June 4, 2013

Timing signoff: maybe it’s time to get rid of the clock

The effort needed in timing signoff could lead to a shift in design towards asynchronous techniques unless advanced OCV technologies improve.

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June 3, 2013

CMOS “good for another century,” says father of finFET

CMOS approaches are likely to underpin electronics for the next century, according to Chenming Hu, father of the finFET

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June 3, 2013

UPF group moves to consider system-power issues

The group that developed the IEEE 1801 Unified Power Format standard is looking to bringing power modeling and estimation to the system level for version 3.0, due in 2015.

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June 3, 2013

Embedded world ‘needs EDA’s models’

The EDA industry has a way to capture the embedded software market, analyst Gary Smith said ahead of DAC. But it’s not through tools – it’s through models.

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May 30, 2013

Latest version of IEEE 1801/UPF available for free

The latest revision of the IEEE 1801 Unified Power Format standard for verifying low-power designs has been made available through the IEEE Get Program.

May 29, 2013

TSMC and Xilinx forge tighter bonds to speed up finFET port

Xilinx and TSMC are forming a single engineering team to accelerate development of a family of finFET-based field programmable gate arrays (FPGAs).

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May 28, 2013

Fabless, IP designers need process simulation tools, says Coventor CTO

Fabless designers and IP providers need process simulation tools to understand how process variability could affect their designs.

May 22, 2013

DAC 2013 Preview IX: Manufacturability

A look at what you can learn about design for manufacturability and yield at this year’s Design Automation Conference

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