Belgian research institute Imec describes, for the first time, the selective chemical vapor deposition (CVD) of germanium-tin (GeSn) in a production-like environment using commercially available Ge and Sn precursors. The resulting GeSn layers with 8% Sn are defect free, fully strained and thermally stable for temperatures up to 500°C. The technique is used to implement [...]
By the time a serious lithography-related problem is identified at the fab, it is too late in the design process to make simple layout changes. To avoid or reduce design delays, Infineon Technologies uses lithography simulation to detect weak points in a layout and analyze the effect of lithography on the design’s electrical performance. Its [...]
Current shortages could switch in key markets by the end of the year.
DRC+ is a new methodology that algorithmically characterizes design variation through pattern classification. A traditional design rule is used to identify all design structures that share a common configuration. Then, the 2D geometric situations (pattern variations) around the configuration are extracted and classified. Since all such classes share a common configuration, each situation class represents [...]
Fab owners are looking to bring down their energy consumption to match the greening of semiconductors themselves.
Nanotechnology's economic potential will only be harnessed through more basic research, according to a new report from the NSF. Paul Dempsey reports.
As part of our nanotechnology focus, we look at the prospects for graphene and carbon nanotubes in electronics. Paul Dempsey reports.
Morris Chang was in on the ground floor of IC innovation at TI and remains there today as chairman of TSMC. Paul Dempsey reports.
Sematech, the leading research consortium for semiconductor manufacturing, has launched a campaign to recruit members from the fabless sector. The move reflects the importance of making manufacturing decisions earlier in the design flow, and is also intended to get input from designers on implementations of such technologies as 3D interconnects, next-generation lithography and novel materials/structures.
Microelectromechanical systems (MEMS) manufacturing continues to be dogged by a technologically and economically inefficient landscape where too many products demand their own bespoke processes and packages. However, the last three years have seen third-party foundries gain more influence over the sector, bringing greater demands for reuse and DFM considerations, earlier in the design flow. The [...]