December 1, 2009
3D stacking with TSVs

Making SiP happen in 3D

System-in-package (SiP) used to be thought of as a ‘poor man’s system-on-chip’ (SoC). Not any more. The complexity involved in implementing various levels of functionality on a single SoC is reaching such levels that it is becoming increasingly difficult to justify the design and manufacturing costs. Similarly, the need to deliver products within equally tight […]

Article  |  Topics: EDA - DFM  |  Tags: ,
November 1, 2008

Defying the downturn

Emerging technologies and markets could spur PCB tool growth despite economic concerns, says Mary Ann Olsson The worldwide PCB EDA software market maintained fairly stable 3.4% growth in 2007. Sales reached $532.5M, from $514.7M in 2006. The projected growth rate for PCB software in 2008 is 2.3%, bringing sales to $544.7M (Figure 1). One key […]

Article  |  Topics: PCB - Layout & Routing  |  Tags: , ,   |  Organizations:


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