![3D stacking with TSVs](https://www.techdesignforums.com/practice/files/2009/12/eda0912_tsmc3_opt.jpg)
Making SiP happen in 3D
System-in-package (SiP) used to be thought of as a ‘poor man’s system-on-chip’ (SoC). Not any more. The complexity involved in implementing various levels of functionality on a single SoC is reaching such levels that it is becoming increasingly difficult to justify the design and manufacturing costs. Similarly, the need to deliver products within equally tight […]