DAC 52 keynotes focus on body-worn electronics and vehicle design
The 2015 Design Automation Conference in San Francisco will feature keynotes that focus on body-worn electronics such as Google’s Smart Contact Lens and automotive issues.
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
TI uses Cortex-M4F to provide low-power 32bit upgrade for MSP430
Texas Instruments has launched a family of ARM-based microcontrollers intended to act as a migration path from its low-energy 16bit MSP430 series, developing its own flash-capable 90nm process to implement them.
Mentor unites chip-to-package flow with Xpedition Package Integrator
Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.
ARM and Cadence agree to share IP access
ARM and Cadence have signed a deal that provides the IP teams at both companies with access to each other’s cores.
China’s foundry outlook improves but still much to do
Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it’s to be a major chipmaker.
Broadcom sees Chinese automotive as key to Internet of Things
Comms giant to seek out more local partnerships with China poised to account for a third of car sales with each new vehicle featuring 1,000 semis.
Cea-Leti opens FD-SOI design center
CEA-Leti has launched a design center called Silicon Impulse with the intention of lowering the entry barrier to using the FD-SOI process.
IoT and RF ‘to drive FD-SOI adoption’
The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.
Charting out the roadmap for FD-SOI
As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.
Synopsys claims finFET leadership
Synopsys claims its tools have enabled 90% of finFET designs currently going into volume production