November 1, 2008

Inside the hot zone

Floorplanning informed by thermal analysis can significantly improve PCB layouts, writes Robin Bornoff The number of PCB design constraints seems ever increasing. The risk that a design will fail either functional performance or reliability goals grows for each generation. One increasingly popular trade-off addresses a balance between thermal compliance and signal integrity. Components with high […]

Article  |  Topics: PCB - System Codesign  |  Tags: ,   |  Organizations:
December 1, 2007

Mastering the memory maze

Since the early 1980s,most of the semiconductor business has been enthralled by the microprocessor, the PC and commodity DRAMs. For all the talk of potential ‘better markets’ and ‘more profitable businesses to be in’, PCs and their brethren came to represent 35- 40% of the industry’s output. They constituted the prime platform for not only […]

Article  |  Topics: EDA - ESL  |  Tags: ,   |  Organizations:
March 1, 2007

Build vs buy in an SoC world

We are now entering the tail end of an era, and many of us do not even know it. For as long as there have been microprocessors, there have been engineers and engineering teams whose job it was to create interconnects. Although this will undoubtedly continue in some companies, the increasing complexity of systems-on-a-chip (SoCs) […]

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