EDA

Many design teams are looking at ways in which they can make use of 3D integration. Here are eight requirements for an effective 3D-IC design flow.

Electrical rule checks (ERC) are now available to deal with increasing PCB design complexity, speed project delivery and protect the intellectual property within them.

Better upfront analysis can help avoid propagating errors from RTL into the netlist, and reveal a number of ways to improve the quality of your final design.

SoC integration can be accelerated by using virtualization to make the benefits of emulation more accessible to both hardware and software engineers.

Many problems arise during the IP-to-SoC phase of FPGA-based prototyping due to the mix-and-match nature of the prototypes not the actual designs.

Mind how you go. The only truly free thing about open source tools is the download itself. There is, however, a 'third way', matching professional support to these often useful options.

The arrival of the 20nm and finFET-based 14nm and 16nm processes bring with them challenges for custom IC design. These are the five key areas and a methodology that can address them.

Embedded systems are increasingly coming under attack as they hook up to the internet. Coding standards have emerged that make it easier to build code that is secure from the bottom up.

2.5D-IC integration overcomes 2D limitations such as cost, offchip bandwidth bottlenecks and I/O pin scarcity, and offers a route to true 3D-IC integration.

It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.