European teams explore 3D integration tradeoffs
Two leading European research institutes presented their work on the feasibility and cost-effectiveness of monolithic 3D integration at this year’s IEDM.
Two leading European research institutes presented their work on the feasibility and cost-effectiveness of monolithic 3D integration at this year’s IEDM.
UPF power state tables have become unwieldy due to rapid growth in LP design. The new construct, ‘add_power_state’ enables better verification flows.
The RISC-V workshop in California at the end of November 2017 provided the opportunity for Western Digital to commit its own work on processors for internal use to the open-source architecture and for the ecosystem of off-the-shelf cores and tools to expand.
X-Fab has added a process module to its wide voltage- and temperature-range 180nm mixed-signal process that supports a set of transistors with lower 1/f flicker noise.
Minima Processor is working on the first processor cores that will be customized to use its timing-control technology to push supply voltages into the near-threshold zone.
Will discuss how automotive OEMs and chip designers can use AI, deep learning, and convolutional neural networks to achieve better performance than traditional techniques.
Solido acquisition will also add further machine learning expertise to Mentor’s capabilities.
Maxim has used its own mismatch-based PUF technology to support a new line of low-cost security devices.
Arm is putting together a security framework that the company is assembling to support, at least initially, IoT devices based on the Cortex v8M architecture.
Microsemi has set up an ecosystem program around the RISC-V soft cores the company has designed for its FPGAs.