TSMC Altera heterogeneous integration is cool but is it 3D?
This looks more like 2.5D silicon interposer-based technology to us, though it is a major and necessary advance
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
Technical Newsletter #3: Site updates, DATE highlights, CPTF, CDN
The headlines from DATE, CPTF and CDN Live. The latest technical articles. And new features. Our regular update.
The return of the ‘custom’ embedded OS
Colin Walls of Mentor Graphics on a significant surprise in UBM’s latest market survey
Showtime! SNUG and U2U previews
We look at the upcoming Synopsys and Mentor Graphics user meetings in Santa Clara.
CPTF notebook: The end of planar
It’s time for everyone to start thinking about how to handle the incoming finFET age.
Japan one year on: a need to rebuild exposed?
Beyond the earthquake, analyst IHS says the tragedy revealed systemic problems with an aging semiconductor fab base
By the numbers: Penn’s take on WSTS
Future Horizons’ Malcolm Penn warns of capacity crunch later this year
DATE 2012: Coverage roundup
This page brings together all of our coverage from Design Automation and Test in Europe 2012 in Dresden, Germany.
DATE notebook: Aldec builds in more support for VHDL methodology
Aldec has updated its Riviera Pro tool to provide more support for OS-VVM, the recently launched verification methodology for VHDL
DATE notebook: Help for heat-sensitive chips
Until the software is ready, it’s often hard to tell when two neighbouring units on an SoC could combine to push the package past its maximum thermal point. Docea Power aims to help.