silicon interposer

November 16, 2012

3DIC – the advantages and the challenges of vertical integration

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
March 22, 2012

TSMC Altera heterogeneous integration is cool but is it 3D?

This looks more like 2.5D silicon interposer-based technology to us, though it is a major and necessary advance
Article  |  Topics: Commentary, Design to Silicon, Blog - EDA, PCB  |  Tags: , ,

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