3DIC – the advantages and the challenges of vertical integration
The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
silicon interposer
TSMC Altera heterogeneous integration is cool but is it 3D?
This looks more like 2.5D silicon interposer-based technology to us, though it is a major and necessary advance
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