Erich Marschner Accellera’s Unified Power Format (UPF) is in production use today, delivering the low-power system-on-chip (SoC) designs that are so much in demand. Building upon that success, IEEE Std 1801-2009 [UPF] offers additional features that address the challenges of low-power design and verification. These include more abstract specifications for power supplies, power states, and […]
USB offers many advantages for use on embedded systems, although software developers remain concerned about the additional complexity it can bring to an application. For example, software drivers for SPI, RS-232 and other traditional serial protocols typically involve little more than read and write routines, while USB software drivers can span thousands of lines, incorporating […]
When we first reviewed the consumer electronics market at the beginning of the year, there were still hopes that growth could remain statistically flat despite global economic woes. However, at the beginning of the summer, the Consumer Electronics Association revised its forecast down from January’s -0.7% to -7.7%, implying total factory-gate sales of $165B. The […]
The article provides an overview of one common theme in the papers presented at a special session of the 2009 Design Automation Conference, Dawn of the 22nm Design Era. As such, we would recommend that readers wishing to access still more detail on this topic (in particular, on device structures for 22nm and project management […]
The paper presents a fully parallel transistor-level full-chip circuit simulation tool with SPICE accuracy for general circuit designs. The proposed overlapping domain decomposition approach partitions the circuit into a linear subdomain and multiple nonlinear subdomains based on circuit nonlinearity and connectivity. A parallel iterative matrix solver is used to solve the linear domain while nonlinear […]
Circuit noise problems can originate from a variety of sources. By carefully examining attributes of the offending noise you can identify it’s source, thereby making noise reduction solutions become more apparent. There are three subcategories of noise problems: device, conducted and radiated noise. If an active or passive device is the major noise contributor, you […]
The article describes how a methodology based around scalable transaction level modeling (TLM) techniques can be used to enable software design to begin far earlier in a design fl ow and thus allow companies to bring designs to market faster, particularly in time-sensitive sectors. It is based on the creation of high-level hardware models that […]
Our preview of the forthcoming Design Automation Conference concentrates on the User Track that makes its debut there next month. Given that it shares many of the objectives behind this journal, that is hardly surprising. However, it is not the only aspect of DAC that merits investigation. Also in the program, conference chair Dr. Andrew […]
An overview of antenna design considerations is presented. These considerations include system requirements, antenna selection, antenna placement, antenna element design/simulation and antenna measurements. A center-fed dipole antenna is presented as a design/simulation example. A measurement discussion includes reflection parameter measurements and directive gain measurements. Antenna requirements Gain and communication range With the advent of prolific […]
The Design Automation Conference (DAC) returns to San Francisco’s Moscone Center, July 26th-31st, and it is hoped that its proximity to Silicon Valley will see attendances hold up well even in tough times. However, the organizers are looking to more than just geography to guarantee continued interest in chip design’s main annual gathering. This 46th […]
