EDA Topics
Part 4- Power management in OCP-IP 3.0
According to Moore’s Law, system-on-chips (SoCs) should continually become more complex and integrate more components, enabled by each reduction in silicon technologies. However, power consumption does not follow the linear path implied here due to increasing leakage in deep sub-micron technologies. Hence, new power management techniques are needed to reduce power dissipation as much as […]
Silicon test moves up the food chain
Technological advances are often driven by the need to simplify and control a task. Silicon test is a good example. Its requirements are continuously increasing in complexity and this process drives the development and adoption of automated test strategies. A thorough approach to manufacturing test is essential to the delivery of high-quality devices. A whole-chip […]
The A word
According to the International Monetary Fund’s (IMF) latest World Economic Outlook, the possibility of a ‘double-dip’ recession cannot yet be discounted even if current data show the world economy beginning to recover. The IMF’s main concern is that private demand (including consumer spending) is not showing enough strength to restore consistent global GDP growth by […]
Interoperable PDKs accelerate analog EDA innovation
Process design kit (PDK) standards are one area that could greatly help reduce the disproportionate time and effort required to realize the analog portion of a design. PDKs have existed for two decades and provide access to foundry-verified data files for such AMS design elements as parameterized layout cells (PCells). However, most have been constructed […]
Making SiP happen in 3D
System-in-package (SiP) used to be thought of as a ‘poor man’s system-on-chip’ (SoC). Not any more. The complexity involved in implementing various levels of functionality on a single SoC is reaching such levels that it is becoming increasingly difficult to justify the design and manufacturing costs. Similarly, the need to deliver products within equally tight […]
Overcoming the limitations of data introspection for SystemC
The verification, test and debug of SystemC models can be undertaken at an early stage in the design process. To support these techniques, the SystemC Verification Library uses a concept called data introspection. It lets a library routine extract information from SystemC compound types, or a user-specified composite that is derived from a SystemC type. […]
Part 3 – A unified, scalable SystemVerilog approach to chip and subsystem verification
The article describes LSI’s work on the use of a single SystemVerilog-based (SV) verification environment for both the chip and its submodules. The environment is based on SV’s Advanced Verification Methodology (AVM) libraries, although alternatives are available. One particular reason for choosing AVM was that LSI wanted to leverage its transaction-level modeling capabilities as well […]
Bringing a coherent system-level design flow to AMS
For two decades, the benefits of ESL and abstractions have been supposedly confined to engineers working on digital designs and to system architects. Analog and mixed-signal (AMS) design has largely remained a ‘circuit level’ activity. This article shows that tools exist that now also allow AMS engineers to exploit abstraction, and that can make all […]
Ensuring reliability through design separation
System designs have traditionally achieved reliability through redundancy, even though this inevitably increases component count, logic size, system power and cost. The article describes the design separation feature in Altera software that seeks to address these as well as today’s conflicting needs for low power, small size and high functionality while maintaining high reliability and […]
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