EDA Topics

The demands of manufacturing closure at advanced process nodes make the traditional design-then-fix flow unmanageable. At 28nm and below, designers need a solution that can address manufacturing issues at any point in the design process, enabling a true correct-by-construction methodology. An effective solution must provide design-rule-check and design-for-manufacturing analysis using the actual foundry-approved signoff rules [...]

GateRocket's RocketDrive facilitates integration of an FPGA into an HDL simulator to provide a "native" execution of a design on its target FPGA device. The companion RocketVision tool provides software-debugging capabilities that directly identify and enable the rapid resolution of bugs. This article considers the use of these tools in a "device native" verification and [...]

The limited cell count of standard cell libraries is restricting the performance that designs can achieve without resorting to expensive and time-consuming techniques. This article describes the addition of extended cell libraries and novel synthesis tools to a traditional RTL-to-GDSII flow in a new methodology that helps to overcome this performance brake. The technique is [...]

The analysis of important power and temperature metrics for chip design is becoming increasingly inefficient when attempted at the register-transfer level. The article proposes the fundamentals of a system-level modeling strategy that will shrink design times, provide more opportunities for architectural exploration, and deliver significant power savings.

Product engineering services can be efficiently outsourced and even the biggest players are doing it, says Michel Villemain

We talked to Mentor Graphics CEO Wally Rhines about the solutions that already exist to combat increasing design complexity.

Disneyland might be next door, but DAC 2010 is stressing a real-world perspective on chip design. We spoke to general chair Sachin Sapatnekar.

As usual, this issue includes our regular preview of the Design Automation Conference (DAC), taking place this year in Anaheim, California (June 13-18). However, given this journal’s particular focus on practical design information, I wanted to highlight one DAC strand up front. Indeed, given that the event has taken more than its share of criticism [...]

This year's Design Automation and Test in Europe conference heard from a broad range of users and suppliers about the challenges to and solutions for getting optimal yields at advanced process nodes, particularly as the industry advances toward 22nm. This article recaps presentations by four executives at the Dresden-hosted event: Pierre Garnier of Texas Instruments, [...]

The time-dependent dielectric breakdown (TDDB) of inter-metal dielectrics on large-scale chips is becoming an increasingly important reliability issue across several semiconductor markets. This mechanism can cause early failures in use and is difficult to detect by traditional test, and hard to control by traditional reliability techniques.