About Paul Dempsey
Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
August 26, 2011
Just up on the wire services. Here’s the full press release. More on this major story later. Santa Clara, CA, Aug 26. Calypto Design Systems today announced it has acquired Catapult C Synthesis from Mentor Graphics Corporation (NASDAQ: MENT). The merger of two market-leading electronic system level (ESL) products, Catapult C Synthesis and Calypto SLEC […]
August 19, 2011
GlobalFoundries has extended the online registration deadline for its Silicon Valley technical conference on August 30th and published the program for the day-long event. You now have until Wednesday (August 24th) to sign up for the Santa Clara Convention Center on the Global Technology Conference (GTC) site where you will find links to other stops […]
August 16, 2011
You’re not supposed to admit this as a hack, but I am struggling to understand the reasons behind Google’s $12.5bn buy of Motorola Mobility (MMI). It “bothers me” in a Peter Falk-way. There is an embedded systems component to this, but to get to it, we first need to work through some of the higher […]
June 23, 2011
As the 2011 Freescale Technology Forum wraps today in San Antonio, Texas, here are a few of my initial takeaways. They’re nowhere near comprehensive – it’s a huge (and hugely informative) event with 2,300 attendees and 350 hours of technical presentations. We’ll need to take another look at the conference in the next print Tech […]
June 22, 2011
Mentor Graphics has extended its Embedded Linux Platform to support Freescale Semiconductor’s new AMP series of QorIQ multicore processors. The QorIQ AMP (for ‘advanced multi-processing) series features a new multi-threaded 64bit Power Architecture e6500 core with enhanced acceleration, co-processing and new power management capabilities. The first device, T4240, has 12 dual-threaded cores for high-end dataplane […]
June 17, 2011
The Asia series of 2011 Tech Design Forum events has just added a September 2nd stop in Seoul, South Korea. The day long event will focus primarily on IC design with additional sessions on functional verification. We’ll publish full venue and registration details on our event page shortly. In the meantime, the overview abstracts for […]
June 16, 2011
We’ve just heard from the Small Form Factor Special Interest Group (SFF-SIG) that the RS-DIMM rugged embedded memory featured in the latest print edition of Tech Design Forum and online has been renamed XR-DIMM (eXtreme Rugged Dual In-Line Memory Module) with immediate effect. Paul Rosenfeld, SFF-SIG’s president, says the change is intended to “reflect the […]
June 9, 2011
Gadi Singer, vice president of the Intel Architecture Group and General Manager, SOC Enabling Group for Intel, provided an excellent keynote on Wednesday at DAC (June 8th) that didn’t so much set out his company’s shopping list as its strategy for the context of tool and methodology development. We’ll take a closer look at many […]
June 7, 2011
One of the great conundrums in EDA is the rate of adoption of ESL technologies. Everybody knows why more abstraction is needed. It reflects the needs for simultaneous hardware/software co-design, faster time-to-market, a greater mastery of complexity and speedier verification. To name but four. But while it is happening, the process is arguably proving much […]
June 6, 2011
3D IC is already making waves at DAC. At the Gary Smith EDA pre-DAC briefing, Mary Olsson took a conservative view, saying that the technology could be delayed for 5 years, even though many believe it will begin to appear in 2012. She argued that the main challenge the technology faces is the fact that […]