finFET

April 22, 2013
Layout segment showing problem of color splitting with double patterning

The five key challenges of sub-28nm custom and analog design

The arrival of the 20nm and finFET-based 14nm and 16nm processes bring with them challenges for custom IC design. These are the five key areas and a methodology that can address them.
December 4, 2012
Dr David M Fried is Chief Technology Officer - Semiconductor at Coventor, responsible for the company’s strategic direction and implementation of its SEMulator3D Virtual Fabrication Platform.

FinFET tipsheet for IEDM

finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?
Expert Insight  |  Topics: EDA - DFM  |  Tags: , , , , , , , , ,   |  Organizations:
March 28, 2012

FinFETs

It may be necessary to move to three-dimensional 'FinFET' transistors for future process nodes, but what impact will this have on circuit design?
August 23, 2011

Parting of the ways

Intel says ‘trigate’—finFET to others—but depleted silicon-on-insulator also has its post 22nm supporters. Chris Edwards reports on the debate at 2011’s Semicon West.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , , , ,   |  Organizations: ,

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