Virtual prototyping moves further into the mainstream
Carbon Design Systems’ CTO Bill Neifert argues that his company’s deal with Samsung sends a clear signal, whether or not you’re one of his customers.
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
Aldec and Xilinx give ASIC prototyping another nudge
Four HES boards in sequence can handle designs up to 96 million gates.
Getting ready for 20nm
Tackling the three key challenges of 20nm processes: design complexity; the physics of lithography; and economics.
Verification challenges require surgical precision
The verification challenge is best addressed by a combination of highly targeted tools, according to Pranav Ashar, CTO of Real Intent.
CDN Live Beijing: Easing Sigrity into place
Anyone still tempted to regard PCB design as electronics’ sleepy backwater, obviously hasn’t been taking notice of trends not just in shrinking form factors but also I/O and memory standards. Proliferation not just in standards but in speeds have been creating whole new sets of challenges ranging from power and signal integrity right through to […]
CDN Live Beijing: ARM and the Middle Kingdom
It’s not that long since ARM was, to be blunt, rather fussy about the companies to which it licensed its technology – and at what level. Today, ‘ARM in a box’ comes in a number of flavors. Somewhat appropriately, the company linked with Cadence Design Systems and TSMC at the former’s recent CDNLive user conference […]
TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography
TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
EUV nears last-chance saloon
If you were to dramatize the situation for extreme ultraviolet (EUV) as the next-generation lithography technology for chipmaking as a movie, it would by now be in the difficult third act. Having been through many ups and downs, it’s now lying on a hospital bed and it’s not clear whether the slowing pulse will flatline […]
Aart de Geus on the changing face of EDA
The president and co-CEO of Synopsys provides his take on the mounting influence of software and physical effects in the creation of SoCs.
Synopsys to buy SpringSoft
Synopsys is to acquire SpringSoft, expanding its custom-IC tool base and letting it fold debug into its existing HDL flow.