AOCV

January 4, 2016
Interconnect variation in SoC

Timing analysis shifts to statistical

The 10nm process node calls for the use of SOCV techniques during timing signoff to avoid leaving too much performance on the table.
October 6, 2014
Power grid signal track blocking

ARM, TSMC design explores 16nm finFET issues

ARM and TSMC used an extensive pre-planning process, including a static analysis of each module's overall logic structure, to put together a 2.3GHz processor design based around ARM's main 64bit Big.Little pairing for the foundry's 16nm finFET process.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , , , ,   |  Organizations: ,
March 27, 2014
Achieving multi-scenario signoff more quickly and predictably using timing-driven ECO

Achieving multi-scenario signoff quickly and predictably using timing-driven ECO

Using a physically aware flow to ensure that fixing one ECO doesn't introduce another during sign off.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , , ,   |  Organizations:
September 6, 2013

On-chip variation (OCV)

Accounting for on-chip variation (OCV) has become a critical factor in assuring timing closure for nanometer-scale ICs and avoiding over-pessimistic margins.
Guide  |  Topics: EDA - Verification  |  Tags: , , , , , ,

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