PCB Topics

Ethernet is set to become one of the key communications standards for automotive. Early system-level simulation lets designers gauge performance before moving to hardware prototypes.

Second in a two-part series, describing critical rules that should underpin PCB manufacturing, and how new technologies overcome increasing complexity.

First in a two-part series, describing critical rules that should underpin PCB manufacturing, and how new technologies overcome increasing complexity.

The introduction of the DDR4 memory-bus standard will allow system designers to meet aggressive performance targets for their next-generation systems. But the changes required to support the higher datarates of DDR4 place stringent demands on the PCB designer.

A coordinated design methodology fine-tunes chip-to-package PCB layout and routing that involves high-integration devices.

Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.

A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.

Fighter pilots have long trusted highly sophisticated automation. That’s how you can meet the challenges posed by advanced PCB design techniques.

Shifting DFM validation earlier in the flow speeds NPI, cuts respins and gives you a critical edge.

Decoupling capacitor counts are increasing as PCBs deploy more advanced silicon. But you can use automated analysis to bring counts and costs under control.