3D integration technology has split into a number of different approaches, each of which brings a different combination of benefits in terms of performance.
The arrival of the 10nm process will impact the way that designers approach custom and mixed-signal layout. Cadence Design Systems has made changes to its Virtuoso environment that deploy increased automation support and electrically-aware layout to deal with the upcoming issues.
Although FastSPICE simulators are in almost every design flow, requirements are moving beyond the capabilities they can provide. Parallel processing provides a solution.
Wreal modeling brings fast methods for simulating mixed-signal designs into the digital environment. And tools have arrived that make it easier to incorporate existing analog IP.
In pursuit of better design methodologies coupled with shrinking design-cycles, real-number modeling is emerging as a smart verification choice.
Electrically aware layout tools provide a more efficient alternative to time-consuming rip-up-and-retry practices in mixed-signal nanometer IC design.
New layout-dependent effects (LDEs) arise at each process node. This methodology updates LDE parameters and uses on-the-fly simulation for early detection.
It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.
An exclusive extract from Cadence Design Systems' Mixed-Signal Methodology Guide provides an excellent overview of its discrete topic and a flavor of the book as a whole.
Current techniques for modelling RF power amplifiers don't provide the dynamic range necessary to simulate their performance properly when used in the energy-saving envelope-tracking mode necessary to give LTE terminals a decent battery life.
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