First in a two-part series, describing critical rules that should underpin PCB manufacturing, and how new technologies overcome increasing complexity.
The introduction of the DDR4 memory-bus standard will allow system designers to meet aggressive performance targets for their next-generation systems. But the changes required to support the higher datarates of DDR4 place stringent demands on the PCB designer.
Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.
A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
Fighter pilots have long trusted highly sophisticated automation. That’s how you can meet the challenges posed by advanced PCB design techniques.
Decoupling capacitor counts are increasing as PCBs deploy more advanced silicon. But you can use automated analysis to bring counts and costs under control.
In a standing-room-only talk at the recent DesignCon conference, Eric Bogatin explained why comedian Henny Youngman could help them with signal integrity on PCBs.
Electrical rule checks (ERC) are now available to deal with increasing PCB design complexity, speed project delivery and protect the intellectual property within them.
Advanced PCB and IC technologies have to be matched with advanced design and analysis tools if companies are going to produce board designs that are right first time, on time.
‘Envelope tracking’ is not a new technique; it has been known about for more than 50 years. But it could greatly help the power consumption challenges once more facing mobile handset design.
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