Signal integrity (SI) is an ever-growing problem as more interconnect effects and fast clocks increase the chances of crosstalk noise and glitches as well as unexpected signal delays. There has been a significant increase in SI-related timing violations due to the increasing influence of lateral wire capacitance in designs at 65 and 45nm. A fast-increasing […]
This paper describes the main design components and methodology priorities for development of the Sensium system-on-chip for wireless body sensor networks. The device is targeted at vital-sign monitoring and related medical applications. The SoC integrates an ultra-low-power wireless ISM band transceiver, hardware MAC, microprocessor, I/O peripherals, memories, 10b delta-sigma, analog-to-digital converter and custom interfaces. The […]
Before 2001’s historic downturn, the semiconductor industry was primarily driven by the corporate and enterprise markets. This bias led to a somewhat predictable three-year business cycle of peaks and troughs. Corporate buying practices, technology requirements and IT replacement policies are all relatively easy to predict—right down to the nature of the semiconductors that underpin the […]
The Design Automation and Test in Europe (DATE) conference is a comparatively young event—it reached only its 11th edition this March. Nevertheless, it has now firmly established itself on the EDA calendar and this year significantly extended its scope to become the world’s most important electronic systems design automation conference. At the same time, it […]
Version 4.0 of the VHSIC Hardware Design Language was approved by Accellera and passed to the IEEE to begin its formal standards balloting process earlier this year. The article previews some of the key additions and extensions that form part of VHDL in the following areas: Property Specification Language Intellectual Property Protection Hierarchical names Extensions […]
When engineers discuss the status and value of the Design Automation Conference (DAC), one topic tends to recur. Fairly or unfairly, the claim is that there has long been an inherent tension between DAC the technical conference and DAC the exhibition. In short, the technical conference has been seen as biased toward tool developers; the […]
ARC International is one of the largest suppliers of configurable processor technology. It licenses patented configurable multimedia subsystems and CPU/DSP processors that are used to design differentiated products. They are optimized for use in systemson- chip (SoCs) that consume less power, are less expensive to produce and require protection from cloning. The ARC Energy PRO […]
Cswitch’s CS90 Configurable Switch Array device has an interconnect structure, the dataCrossconnect network, that delivers bandwidth at 40- 100Gbps for packet-based applications. For packet handling tasks, the chip includes embedded configurable blocks, Configurable Packet Engines, that support functions such as frame parsing, CRC and hashing, and fast address look-ups, all at up to 1GHz. For […]
Electronic system level (ESL) design is moving to a new stage in its development, advancing from a proof-of-concept environment to one that is seeing its adoption and deployment at the forefront of design. The article terms this shift ‘ESL 2.0’. The reason for this goes beyond mere marketing hype. Inherent in the transition defined above […]
Changes in defect distribution, increasing design complexity and pressures from the specialist I/O and packaging arenas are creating a dilemma during component test. On the one hand, the generation of more test patterns would appear to be necessary; but on the other, fewer test ports are available. The article describes a strategy for addressing this […]
