SFF-SIG

June 2, 2011

Creating a rugged standard for embedded memory

Most memory module standards have not been specified with particular reference to extreme environments where shock and vibration may present significant risk. Rather, designers have had to use a number of workaround techniques, strapping or even directly soldering devices to the board. In addition, the drive toward smaller board sizes is presenting a number of [...]
Article  |  Topics: EDA - DFT  |  Tags: ,

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