Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
July 26, 2012

Xilinx extends Vivado availability

Xilinx says it has made the first public release of its Vivado Design Suite – the reworked design environment for its sub-40mn programmable-logic devices that is based more heavily on concepts from the custom-IC world than its existing ISE toolset.

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July 4, 2012

Cadence plans design kit expansion with Sigrity buy

Cadence Design Systems has purchased Sigrity, the specialist in signal and power integrity, in a deal worth approximately $80m, to extend its IC packaging, PCB and IP portfolio.

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July 3, 2012

Why cell-aware testing is important

Characterizing standard-cell defect mechanisms helps improve IC testing

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June 28, 2012

Chip design – easier than semiconductor IP?

Software-defined-modem IP licensing company Cognovo acquired to help build end products.

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June 22, 2012

TSMC updates BCD process with Analog help

Analog Devices has helped developed a new version of TSMC’s 180nm BCD process for analog and mixed-signal circuits that slashes noise tenfold compared with the original version released in 2009.

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June 20, 2012

Atrenta buys NextOp for assertion synthesis

Atrenta has taken a step into functional verification with the decision to buy NextOp Software, a specialist in assertion synthesis.

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June 14, 2012

The ETSOI strikes back

A day ahead of Intel’s VLSI Technology Symposium paper on its 22nm finFET process, a group led by IBM set out to show that silicon-on-insulator (SOI) devices could do as well not only on low-power, where SOI has traditionally had the edge, but high-performance circuits.

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June 14, 2012

Strained silicon beats TSV stress in 3DICs

Texas Instruments had good news for teams that want to assemble 3DIC stacks using thru-silicon vias (TSVs). The stress induced by the copper TSVs is not as bad as many feared for nanometer-scale transistors.

June 13, 2012

Low-power logic for steampunks

MEMS relay-based devices offer the ultimate in subthreshold leakage: they don’t have any. Design and technology advances are promising to overcome problems with reliability, design and speed, according to Tsu-Jae King Liu of UC Berkeley.

June 13, 2012

Foundation plans virtual ISA for heterogeneous systems

Six companies have come together to launch a foundation intended to develop standards for software that can run on a wide variety of computers based on a heterogeneous mix of processors.

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