The Boundary Condition Independent Reduced Order Model (BCI-ROM) provides vital help in addressing growing electro-thermal challenges in SPICE simulation.
German consultancy E-Cooling describes its strategy for thermal and airflow analysis.
Our extended fireside chat with Mentor Chairman and CEO Wally Rhines begins by canvassing his thoughts now the Siemens deal is done.
Reliability is growing to match security as a key challenge for PCB design. These tools and techniques will help you rise to it.
Keeping noise levels down was one of the priorities for two companies working independently on configurable power supplies – but without compromising DFM and thermal performance.
Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.
Floorplanning informed by thermal analysis can significantly improve PCB layouts, writes Robin Bornoff The number of PCB design constraints seems ever increasing. The risk that a design will fail either functional performance or reliability goals grows for each generation. One increasingly popular trade-off addresses a balance between thermal compliance and signal integrity. Components with high […]