thermal integrity

April 5, 2012

Overcoming increasing PCB complexity with automation

Advanced PCB and IC technologies have to be matched with advanced design and analysis tools if companies are going to produce board designs that are right first time, on time.
November 1, 2008

Inside the hot zone

Floorplanning informed by thermal analysis can significantly improve PCB layouts, writes Robin Bornoff The number of PCB design constraints seems ever increasing. The risk that a design will fail either functional performance or reliability goals grows for each generation. One increasingly popular trade-off addresses a balance between thermal compliance and signal integrity. Components with high […]

Article  |  Topics: PCB - System Codesign  |  Tags: ,   |  Organizations:

PLATINUM SPONSORS

Synopsys Cadence Design Systems Siemens EDA
View All Sponsors