5.5D-IC

November 16, 2012

3DIC – the advantages and the challenges of vertical integration

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.

Article | Topics: Blog - EDA, - Industry Blogs | Tags: 2.5D-IC, 2.5DIC, 3D-IC, 3DIC, 5.5D-IC, 5.5DIC, more, silicon interposer | Organizations: Micron Technology, Samsung Electronics, Synopsys, Xilinx