EDA Topics

June 1, 2007

DAC past, present and future

When I left the semiconductor industry to become an EDA Analyst, I was struck by two things. The first was the professionalism of the PR firms handling the EDA accounts. They not only did jobs that would be expected of them by silicon vendors, but also performed functions that we would consider part of a […]

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June 1, 2007

New breed of SPYDER discovered

Freescale Semiconductor manufactures some of the industry’s most widely used microcontrollers. The article describes the functionality behind the new Background Debug Module that has been developed for its 8 and 16bit MCUs. The BDM provides all that is needed to write, compile, download, in-circuit emulate and debug code, when deployed in conjunction with the well-known […]

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June 1, 2007

Broaden your perspective

Some 161 papers will feature during this year’s 44th Design Automation Conference (June 4-8) in San Diego with four strands at the forefront. System-level design (ESL), design for manufacturing/yield (DFM/DFY), low-power design and verification accounted for more than 40% of submissions this year, and the final line-up represents these topics in broadly similar proportion. For […]

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March 1, 2007

Confronting chip assembly challenges

Until recently, hierarchical design flows have been favored for the implementation of multi-million gate SOCs. However the rapid increases in design size brought on by nanometer process geometries have seen engineers seek to cope with the inherently block-based nature of such flows by seeking greater concurrency between the block implementation and chip assembly stages in […]

March 1, 2007

Scan infrastructure and environment for enhanced at-speed ATPG

A major issue faced by SoC design teams adopting 90nm and 65nm process nodes is the increase in yield fall-out. At 90nm it is estimated that 30% of yield fall-out is due to performance and signal integrity issues. As a result, accurate and cost effective at-speed manufacturing test and characterization has become evermore critical to […]

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March 1, 2007

Revealing the hidden cost of performance for physical verification

The increasingly onerous nature of physical verification at today’s nanometer process geometries requires the regular benchmarking of appropriate tools, if designs are to be realized in a cost-effective manner. However, the criteria for such benchmarking are all too often limited to relatively simplistic notions of ‘performance’. The article explains that the real cost of physical […]

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March 1, 2007

Automating design for high volume consumer markets

There has been a recent trend for tools originally aimed at ASIC designs to be applied to the design of high-volume projects aimed at markets such as consumer electronics. The article argues that there are a number of fundamental flaws in such a strategy. For example, an ASIC tool might be designed for an environment […]

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March 1, 2007

From A to B via Z

How important is it that the history of electronics is passed on from generation to generation of engineers in the ‘right’ way. OK, let’s acknowledge that, as in war, history is always dominated by the victors, not the losers. Let’s also admit that anyone with a career in this business wants its image to be […]

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March 1, 2007

Double figures for DATE

DATE 07 (April 16-20) marks an important milestone for the Design Automation and Test in Europe conference as it reaches its tenth edition. As we went to press, the main technical program was still being finalized, but DATE has again received record submissions, 933 against last year’s 834. The most obvious change in 2007 is […]

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March 1, 2007

Electronic system level design for embedded systems

There is a growing productivity gap in the design of embedded systems. One recent survey estimated that the number of lines of embedded code written per year is growing at a rate of 46% a year, although the number of developers available to write it is growing at only 7.5%. The problem is further compounded […]

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