How important is it that the history of electronics is passed on from generation to generation of engineers in the ‘right’ way. OK, let’s acknowledge that, as in war, history is always dominated by the victors, not the losers. Let’s also admit that anyone with a career in this business wants its image to be […]
The relative performance of a single processor has leveled off in the last decade. Built-in instruction-level parallelism is becoming less efficient because issuing more than four instructions in parallel has little effect on most applications. Meanwhile, recent attempts to boost performance have come dangerously close to the energy/power consumption ceiling. Dedicated hardware accelerators may prove […]
Chip and package design are all too often still seen as separate stages in the design process. In today’s nanometer age and with the growing use of techniques such as system-in-package, this lack of integration can have catastrophic results. Package designers frequently encounter overly complex and un-routable silicon that requires multiple iterations to fix. Problems […]
The increasingly onerous nature of physical verification at today’s nanometer process geometries requires the regular benchmarking of appropriate tools, if designs are to be realized in a cost-effective manner. However, the criteria for such benchmarking are all too often limited to relatively simplistic notions of ‘performance’. The article explains that the real cost of physical […]
A major issue faced by SoC design teams adopting 90nm and 65nm process nodes is the increase in yield fall-out. At 90nm it is estimated that 30% of yield fall-out is due to performance and signal integrity issues. As a result, accurate and cost effective at-speed manufacturing test and characterization has become evermore critical to […]
PCI Express is a point-to-point communications interface. It is neither an evolved nor enhanced form of PCI or PCI-X, but, essentially, a high speed, low voltage, differential serial pathway for communication between two devices, although it uses the same programming model as its predecessors. It employs a protocol that allows devices to communicate simultaneously by […]
The use of poly-Si TFTs for active matrix OLEDs (AMOLEDs) allows peripheral circuits to be integrated on a glass substrate at low cost and reduces the number of external driver ICs. The prospect of such integration means it is likely that emerging system-on-glass (SOG) design projects will feature both analog and digital blocks, such as […]
Leakage has become a critical concern for sub-100nm silicon process technologies. It had started to become a significant factor in a chip’s overall power profile at 130nm, but by 90nm things had worsened with leakage accounting for perhaps 30% of a chip’s total power consumption. At 65nm, leakage represents more than 50% of power consumption. […]
What do we mean by a ‘left shift’ in design for manufacturing (DFM) analysis? Think of it as moving the DFM analysis from a tool run by the manufacturer into an integrated solution within the printed circuit board (PCB) design system. It is a major advance in the design of PCBs, allowing users to ultimately […]
In late 2001, Nick Baker and other members of the Ultimate TV team at Microsoft learned that the company was ending development work on the product. For a still youthful engineer whose curriculum vitae already took in some ill-fated early-days video card work at Apple and the short-lived 3DO games console, Baker could have been […]
