How do we bridge the gap between the highly abstract view provided by traditional system-level design and the detailed implementation in RTL? The article answers this question by describing the components within an ESL methodology and illustrating its use via customer case studies. The methodology uses the ARM RealView SoC Designer tool and Tenison Design […]
US factory-to-dealer sales of consumer electronics will surpass $155B in 2007, representing 7% growth, according to the most recent forecast from the Consumer Electronics Association. This performance will follow on from an expected $145B market in 2006, a year which surpassed even the most optimistic forecasts by logging growth of 13%. “The industry outlook is […]
We are now entering the tail end of an era, and many of us do not even know it. For as long as there have been microprocessors, there have been engineers and engineering teams whose job it was to create interconnects. Although this will undoubtedly continue in some companies, the increasing complexity of systems-on-a-chip (SoCs) […]
The relative performance of a single processor has leveled off in the last decade. Built-in instruction-level parallelism is becoming less efficient because issuing more than four instructions in parallel has little effect on most applications. Meanwhile, recent attempts to boost performance have come dangerously close to the energy/power consumption ceiling. Dedicated hardware accelerators may prove […]
Chip and package design are all too often still seen as separate stages in the design process. In today’s nanometer age and with the growing use of techniques such as system-in-package, this lack of integration can have catastrophic results. Package designers frequently encounter overly complex and un-routable silicon that requires multiple iterations to fix. Problems […]
Leakage has become a critical concern for sub-100nm silicon process technologies. It had started to become a significant factor in a chip’s overall power profile at 130nm, but by 90nm things had worsened with leakage accounting for perhaps 30% of a chip’s total power consumption. At 65nm, leakage represents more than 50% of power consumption. […]
PCI Express is a point-to-point communications interface. It is neither an evolved nor enhanced form of PCI or PCI-X, but, essentially, a high speed, low voltage, differential serial pathway for communication between two devices, although it uses the same programming model as its predecessors. It employs a protocol that allows devices to communicate simultaneously by […]
The use of poly-Si TFTs for active matrix OLEDs (AMOLEDs) allows peripheral circuits to be integrated on a glass substrate at low cost and reduces the number of external driver ICs. The prospect of such integration means it is likely that emerging system-on-glass (SOG) design projects will feature both analog and digital blocks, such as […]
Consumer electronics is a difficult business.Market windows open and close quickly. Cost is critical. Requirements change unpredictably. Risk is high. Functionality and performance increase with every product generation, while both manufacturing-limitations and feature-driven demand require low power implementations. Of all these, power constraints have the largest impact on current product architectures. As CMOS reaches its […]
Timing closure is one of the major problems faced by SoC designers. The inclusion of several, often diverse, IP cores that need to communicate with each other on a chip makes it difficult for a designer to meet the complex timing requirements between these cores. Furthermore, as process nodes shrink, process variability becomes a more […]