high-density interconnect

A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.

Fighter pilots have long trusted highly sophisticated automation. That’s how you can meet the challenges posed by advanced PCB design techniques.

What impact do HDI via structures have on PCB design metrics? Andy Kowalewski describes a recent experiment. A PCB’s density has traditionally been seen as a function of the trace and space geometry and the number of signal layers. Emerging technologies such as microvias and buildup fabrication may force us to rethink this formula. In […]