microvia

Early use of design for manufacturing can capture PCB yield issues related to pads, copper distribution, same net slivers and more

What impact do HDI via structures have on PCB design metrics? Andy Kowalewski describes a recent experiment. A PCB’s density has traditionally been seen as a function of the trace and space geometry and the number of signal layers. Emerging technologies such as microvias and buildup fabrication may force us to rethink this formula. In […]