GlobalFoundries intends to offer a 12nm FinFET process as a stepping stone from its 14nm process. AMD will be the lead customer.
The new 12LP technology can increase circuit density by up to 15 per cent with a potential improvement of 10 per cent in performance over the 14nm process.
Mark Papermaster, CTO and senior vice president of technology and engineering at AMD, said: “We plan to introduce new client and graphics products based on GF’s 12nm process technology in 2018.”
In addition to transistor-level enhancements, the 12LP platform will include features specifically designed for automotive electronics and RF/analog applications. The foundry plans Automotive Grade 2 qualification at Fab 8 where the wafers will be run by Q4 2017.
The 12nm finFET process will be offered alongside the FD-SOI version, which will continue for applications that are looking for lower power consumption. The foundry is making additions to the older 22nm FD-SOI, providing embedded magnetic RAM support through its cooperation with specialist Everspin Technologies.
Customer prototyping of 22FDX eMRAM on multi-project wafers (MPWs) is on track for the first quarter of 2018, with risk production planned by the end of 2018.