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GlobalFoundries
GlobalFoundries
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August 27, 2014
Six key criteria for deciding to migrate to a finFET process
Moving to a finFET process means considering process readiness, cost and yield, as well as the traditional power, performance and area advantages
Expert Insight | Topics:
EDA - IC Implementation
,
IP - Selection
| Tags:
finFET
,
PPA
,
PPARCY
| Organizations:
GlobalFoundries
,
Intel
,
Samsung Semiconductor
,
Synopsys
,
TSMC
,
UMC
June 10, 2014
Zeroing in on the problems of fast board-level interconnect
A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.
Article | Topics:
PCB - Design Integrity
,
EDA - IC Implementation
| Tags:
advanced packaging
,
DAC 2014
,
finFET
,
high-density interconnect
,
power integrity
,
Serial IO
,
signal integrity
| Organizations:
Altera
,
Cadence Design Systems
,
Cisco
,
GlobalFoundries
,
Intel
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