monolithic 3DIC

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June 5, 2014

3D and EDA need to make up for Moore’s Law, says Qualcomm

Qualcomm is looking to monolithic 3D and smart circuit architectures to make up for the loss of traditional 2D process scaling as wafer costs for advanced nodes continue to increase.

Article | Topics: Blog - EDA | Tags: 3DIC, circuit design, DAC 2014, interconnect resistance, mobile phone, monolithic 3DIC | Organizations: Qualcomm

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