DVCon China 2019 preview: OneSpin

By TDF Staff |  No Comments  |  Posted: April 3, 2019
Topics/Categories: Blog - EDA, - Verification  |  Tags: ,  | Organizations: ,

Formal and integrity verification specialist OneSpin will present a poster and deliver a technical workshop during DVCon China, as well as exhibiting at Booth #107. This year’s Chinese edition takes place April 17 at the Crowne Plaza Hotel in Century City Shanghai

The poster from Nicolae Tusinschi, OneSpin Product Specialist – Design Verification, considers ‘Scaling Formal Connectivity Checking to Multi-Billion Gate SoCs with Specification Automation’.

Tusinschi will also present the OneSpin-sponsored short workshop, ‘Portable Coverage: Integrating Formal and Simulation Coverage for Efficient, Faster Verification Signoff.

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