EDA Topics

How SystemC enables system modelling at higher levels of abstraction, and the creation of virtual platforms.

It may be necessary to move to three-dimensional 'FinFET' transistors for future process nodes, but what impact will this have on circuit design?

Fully depleted silicon on insulator (FD-SOI) transistor architectures may offer speed and power advantages, at the cost of a shift to non-standard substrates.

Transaction-level modeling (TLM) describes a system by using function calls that define a set of transactions over a set of channels.

Double patterning provides an alternative to using EUV lithography – making it possible to implement ICs on sub-28nm processes.

The IEEE Unified Power Format (UPF) standard is intended to support low-power designs that use switchable power states and power islands.