3DIC

Many design teams are looking at ways in which they can make use of 3D integration. Here are eight requirements for an effective 3D-IC design flow.

2.5D-IC integration overcomes 2D limitations such as cost, offchip bandwidth bottlenecks and I/O pin scarcity, and offers a route to true 3D-IC integration.

It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.

Meeting the challenges of moving beyond planar integration to side by side, and eventually truly stacked, dice, for designers, tool vendors and the supply chain.

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.

Sematech, the leading research consortium for semiconductor manufacturing, has launched a campaign to recruit members from the fabless sector. The move reflects the importance of making manufacturing decisions earlier in the design flow, and is also intended to get input from designers on implementations of such technologies as 3D interconnects, next-generation lithography and novel materials/structures.

System-in-package (SiP) used to be thought of as a ‘poor man’s system-on-chip’ (SoC). Not any more. The complexity involved in implementing various levels of functionality on a single SoC is reaching such levels that it is becoming increasingly difficult to justify the design and manufacturing costs. Similarly, the need to deliver products within equally tight […]

Emerging technologies and markets could spur PCB tool growth despite economic concerns, says Mary Ann Olsson The worldwide PCB EDA software market maintained fairly stable 3.4% growth in 2007. Sales reached $532.5M, from $514.7M in 2006. The projected growth rate for PCB software in 2008 is 2.3%, bringing sales to $544.7M (Figure 1). One key […]