If you want a chance to present your latest work on an electron-based device, it’s time to get your act together. The paper submission deadline for the 59th annual IEEE International Electron Devices Meeting (IEDM) is Monday, June 24, 2013 at 23:59 PST.
IEDM is one of the key technology conferences in the electronics industry and provides a forum for announcements about device technology and process architecture, which are often then followed a few months later at ISSCC with the introduction of a novel chip using that device or process.
2012 was no exception, with Intel and TSMC both providing insights into their finFET processes, lively discussions about the relative merits of finFETs and FD-SOI, and insights into the future of the semiconductor industry during conference keynotes.
This year, the organisers are particularly looking for papers focusing on circuit and process technology interactions, energy harvesting, bio-sensors and bioMEMS, power devices, magnetics and spintronics.
Other topic areas include:
- circuit and device interaction
- characterisation, reliability and yield
- display and imaging systems
- memory technology
- modeling and simulation
- nano device technology
- process and manufacturing technology
- power and compound semiconductor devices
- sensors, MEMs and bioMEMS
The 2013 IEDM will take place at the Washington Hilton Hotel from 9 to 11 December, 2013, and will be preceded by a full day of short courses on Sunday, 8 December, and 90-minute afternoon tutorial sessions on Saturday, 7 December.
For more info, click here.