Volumes

December 1, 2007

UPF delivers on power

Long before the first portable computer batteries exploded, and even before anyone had the first visions of building massive data centers in the cold northwestern states of Oregon,Washington and Alaska, power consumption by electronic devices was a tough problem for chip designers. The difference now is that we are trying to manage power in ever-smaller […]

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December 1, 2007

The simulation and design of software-defined radios

The paper discusses the simulation, design, and test of software-defined radios (SDRs), initially using a legacy 16QAM waveform, followed by a new SDR waveform -orthogonal frequency division multiple access (OFDMA). The SDR system’s error vector magnitude (EVM) is first analyzed and its performance is compared with the legacy waveform results. The implementation also includes the […]

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December 1, 2007

Start Here

Every economic wobble sees technology’s ciabattering classes put down their salad-stuffed sandwiches and decaf mochas to forewarn of threats to venture capital (VC) investment. And so has it gone since the sub-prime mortgage bug finally bit. OK, as a public service, here’s the skinny. We surveyed 20 VC firms and corporate venturing arms and got […]

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December 1, 2007

Portable multimedia SoC design: a global challenge

Today more than ever, the difference between design success and failure resides in engineers’ ability to master all critical design factors at once. Meanwhile, systems-on-chip (SoCs) represent a multidisciplinary challenge that spans the entire flow from architecture through design to test and finally mass production. For portable applications in particular, SoCs present especially stringent constraints […]

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December 1, 2007

Mastering the memory maze

Since the early 1980s,most of the semiconductor business has been enthralled by the microprocessor, the PC and commodity DRAMs. For all the talk of potential ‘better markets’ and ‘more profitable businesses to be in’, PCs and their brethren came to represent 35- 40% of the industry’s output. They constituted the prime platform for not only […]

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December 1, 2007

Implementing DDR3 DIMMs with modern FPGAs

While DDR3 SDRAM offers speed and low-power benefits, the fly-by termination topology defined by the JEDEC specification for DDR3 SDRAM DIMMs creates interesting challenges for FPGAs. The JEDEC topology significantly reduces the simultaneous switching noise that plagues high-frequency parallel interfaces, but also introduces the need for read and write leveling to compensate for the deliberate […]

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December 1, 2007

Asynchronous clocks prove tough for verification

For simulation to correctly predict silicon behavior, the logic implementing a design should adhere to the setup and hold constraints specified for clocked elements. However, with multiple asynchronous clocks on a single chip driving logic, designers cannot help but violate setup and hold constraints. This causes metastability, which in its turn leads to non-deterministic delays […]

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November 1, 2007

What to look for when using an external PCB design center

The successful completion of complex PCB layouts requires a combination of highly skilled and experienced layout designers, a structured front-to-back design process, and advanced EDA toolsets. Success can be defined as meeting or exceeding all electrical, mechanical, and manufacturing requirements, and, where an external PCB design center is involved, satisfying the client in all interactions [...]
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September 1, 2007

Automating the SSN verification challenge

Simultaneous Switching Noise (SSN) is the voltage fluctuation caused by the simultaneous switching of groups of output chip I/O drivers that drive high slew rate signals. It has an impact on I/O and core power supply lines and on signal lines, and is an increasingly important challenge for designs that incorporate high performance interfaces, such […]

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September 1, 2007

What to look for when using an external PCB design center

The paper outlines the criteria upon which an OEM should make its selection of a third-party PCB design supplier. It groups these into three main categories. Staff with appropriate technical and communications skills. Comprehensive and fully documented design processes (ranging from the use of consistent design strategies to approaches to component library maintenance). Tool support […]

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