IC Implementation

June 1, 2007

Share and share alike

For a design targeted at the 130nm process node or below, the cost of a dedicated mask-set is getting brutal. At 130nm itself, a semiconductor company is likely to pay between $500,000 and $600,000 per set. That price tag rises to around $1m at 90nm, and to $1.5m at 65nm(Figure 2). One recent forecast for […]

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June 1, 2007

Advances in fast-SPICE for mixed-signal SoC verification

Today, most SoC designs include both digital and analog components on the same chip, taking advantage of nanometer geometries. This demands that the current design flow bottleneck due to analog verifi-cation and integration is addressed in ways that enable this process to be completed both thoroughly and efficiently. SPICE simulation was accurate but slow and […]

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March 1, 2007

From A to B via Z

How important is it that the history of electronics is passed on from generation to generation of engineers in the ‘right’ way. OK, let’s acknowledge that, as in war, history is always dominated by the victors, not the losers. Let’s also admit that anyone with a career in this business wants its image to be […]

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March 1, 2007

Double figures for DATE

DATE 07 (April 16-20) marks an important milestone for the Design Automation and Test in Europe conference as it reaches its tenth edition. As we went to press, the main technical program was still being finalized, but DATE has again received record submissions, 933 against last year’s 834. The most obvious change in 2007 is […]

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March 1, 2007

Automating design for high volume consumer markets

There has been a recent trend for tools originally aimed at ASIC designs to be applied to the design of high-volume projects aimed at markets such as consumer electronics. The article argues that there are a number of fundamental flaws in such a strategy. For example, an ASIC tool might be designed for an environment […]

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December 1, 2006

Design of SoG with p-SI TFTs using AMS simulation for AMOLEDs

The use of poly-Si TFTs for active matrix OLEDs (AMOLEDs) allows peripheral circuits to be integrated on a glass substrate at low cost and reduces the number of external driver ICs. The prospect of such integration means it is likely that emerging system-on-glass (SOG) design projects will feature both analog and digital blocks, such as […]

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September 1, 2006

Last of the Pioneers

Wilf Corrigan ‘Epitaxy innovator’, ‘ASIC champion’, ‘SIA founder’. Those are a few of the descriptions you could apply to Wilf Corrigan. Another, until May, was ‘Last of the Pioneers’ – but then, after 46 years of involvement with major chip companies, Corrigan stepped down as chairman of LSI Logic, the company he set up with […]

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September 1, 2006

A top-level verification methodology including power supply and signal check using mixed-signal simulation

The ‘state-of-the-art’ solution for wireless transceiver RF ICs is single chip CMOS, integrating digital, analog, and RF blocks on a single chip. The architectures involved require new and challenging approaches to verification. To understand these, we first need to look back at the history of the transceiver architectures used for wireless mobile phone implementations during […]

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September 1, 2006

Coverage-driven verification for the analog domain

The verification of digital sub-systems is based on advanced techniques such as constraints capture, randomized or pseudo-randomized stimuli generation and results collection with functional coverage evaluation. The use of manually verified hand-coded analog block models within a digital verification environment has so far been sufficient. However, the move to greater levels of integration, shrinking process […]

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June 1, 2006

Back on the bay

Ellen Sentovich As EDA Tech Forum went to press, the programme for 2006’s Design Automation Conference (July 24-28) in San Francisco was only just being made public. However, one thing was already clear. The event is set to be bigger than ever before. “We had been concerned about the move to July because of the […]

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