IC Implementation

December 6, 2012

20nm timing analysis – a practical and scalable approach

Using hierarchy and improved constraints management to accelerate static timing analysis at 20nm and below.
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December 3, 2012

Overcoming dummy fill deck limitations for analog design

CSR used a customized approach to automated dummy fill layout for AMS to address layer density and device matching issues in standard flows aimed at digital SoCs.
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November 16, 2012
Marco Casale-Rossi

3DIC – the advantages and the challenges of vertical integration

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.
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October 23, 2012

Vivado, inside the new Xilinx design suite

The FPGA vendor's new flagship is now on public release. It adds an array of features, including support for system-level to HDL synthesis.
October 9, 2012

Physical verification of 20nm designs through integrated double-patterning analysis and repair

Finding and fixing double patterning problems in 20nm designs
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September 12, 2012

Critical tools for 20nm design

A look at the way in which key tools, in IC implementation, modeling and extraction, and physical verification, are developing in response to the challenges of 20nm design
September 9, 2012

Clock domain crossing

IC designs with multiple clock domains are now commonplace. They make it possible to optimize for power by varying clock frequency and voltage as well as for timing by removing the need to distribute a single, low-skew clock to all parts of a design. The problem is that the use of multiple clock domains introduces […]

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May 23, 2012

VHDL

VHDL is a hardware description language with rich constructs that can model complex systems. It can also be constrained for use as the starting point of an FPGA or ASIC design.
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May 21, 2012

Modelling envelope-tracking RF PAs for LTE at high dynamic range

Current techniques for modelling RF power amplifiers don't provide the dynamic range necessary to simulate their performance properly when used in the energy-saving envelope-tracking mode necessary to give LTE terminals a decent battery life.
March 28, 2012

FinFETs

It may be necessary to move to three-dimensional 'FinFET' transistors for future process nodes, but what impact will this have on circuit design?

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