The 2021 IEEE International Reliability Physics Symposium (IRPS) is to be held virtually from March 21 to 24 and will take in the behavior of novel and emerging devices as well as conventional semiconductor and microelectronic assemblies.
“The Symposium technical program continues to evolve to keep pace with emerging trends in microelectronics reliability, including wide bandgap semiconductors, neuromorphic computing reliability, advanced memory technologies, and RF/mmW/5G device reliability,” said Chris Connor of Intel, who is IRPS 2021 technical program chair.
The symposium will include more than twenty 90-minute tutorial sessions throughout the conference, as well as interactive evening workshops covering six different reliability topics on Tuesday, March 23. Three focus sessions at IRPS will combine both invited and accepted papers in emerging areas such as neuromorphic compute, the reliability of RF and millimeter-wave circuitry, and in emerging memory technologies such as STT-MRAM and ferroelectric hafnium dioxide devices.
In addition to the technical paper sessions, the conference will feature four keynotes. Seok-Hee Lee, president & CEO of SK Hynix will focus on memory technologies, Cree/Wolfspeed CEO John Palmour will focus on silicon carbide devices. Peter Gammel, CTO MWI at GlobalFoundries, will examine the technologies needed for 6G communications and Alessandro Plovaccari, CTO of Silicon Labs will cover the reliability issues around IoT end nodes.