Two keynote speakers have been announced for the DVCon Europe 2018 conference taking place next month (October 24-25).
The conference, to be held in Munich, Germany, will feature keynotes from Stefan Jockusch, vice president of strategy at Siemens PLM Software, and Philippe Magarshack, group vice president of the MDG Group at STMicroelectronics.
“This year’s DVCon Europe introduces a variety of exciting, innovative topics of great interest to the European design and verification community, including functional safety, virtual prototyping, machine learning, portable stimulus, RISC-V, and many more,” said Martin Barnasconi, DVCon Europe 2018 general chair. “We’ve created a strong technical program, which will be complemented with two fantastic keynotes presented by Stefan Jockusch and Philippe Magarshack, two well-known players in the European electronics community in driving innovation and leading edge technologies across our continent.”
Jockusch’s keynote, “Driving Digitalization With A Boundary Free Innovation Platform”, will be on October 24, the first day of the conference. In it Jokusch will argue we are at the beginning of a radical change of the way products are created, produced, and utilized. As a consequence of continuing digitalization, leading technology companies are pursuing the idea of a complete, high fidelity ‘digital twin’ that makes the boundaries between the design process of mechanical parts, electronics, embedded software, sensors and specialized IC and sensor technology disappear. The talk will discuss how this digital twin is affecting autonomous driving, additive manufacturing, IoT technology, and many other applications.
On October 25, Magarshack will deliver the second conference keynote address: “Accelerating IoT Device Development – from Silicon to Developer Tools”. His argument will be that the IoT is accelerating thanks to the broad availability of affordable building blocks for IoT devices combined with ubiquitous wireless connectivity, cloud computing, and artificial intelligence. The development of IoT SoCs pose a number of challenges for chipmakers in order to enable successful first silicon and fast bring-up.