Volume 4

March 1, 2007

Automating design for high volume consumer markets

There has been a recent trend for tools originally aimed at ASIC designs to be applied to the design of high-volume projects aimed at markets such as consumer electronics. The article argues that there are a number of fundamental flaws in such a strategy. For example, an ASIC tool might be designed for an environment […]

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March 1, 2007

Build vs buy in an SoC world

We are now entering the tail end of an era, and many of us do not even know it. For as long as there have been microprocessors, there have been engineers and engineering teams whose job it was to create interconnects. Although this will undoubtedly continue in some companies, the increasing complexity of systems-on-a-chip (SoCs) […]

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March 1, 2007

System-level design matures

How do we bridge the gap between the highly abstract view provided by traditional system-level design and the detailed implementation in RTL? The article answers this question by describing the components within an ESL methodology and illustrating its use via customer case studies. The methodology uses the ARM RealView SoC Designer tool and Tenison Design […]

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March 1, 2007

Start Here

Look at what is supposed to be a stellar-performing market: displays. According to data from the Consumer Electronics Association, large screen plasma and LCDs are flying out of the stores.Yet the major suppliers spent much of Q4 2006 getting seriously beaten up on price. Moreover, the likelihood of a third technology entering that market, SED […]

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March 1, 2007

Scan infrastructure and environment for enhanced at-speed ATPG

A major issue faced by SoC design teams adopting 90nm and 65nm process nodes is the increase in yield fall-out. At 90nm it is estimated that 30% of yield fall-out is due to performance and signal integrity issues. As a result, accurate and cost effective at-speed manufacturing test and characterization has become evermore critical to […]

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