System Codesign

November 1, 2008

Inside the hot zone

Floorplanning informed by thermal analysis can significantly improve PCB layouts, writes Robin Bornoff The number of PCB design constraints seems ever increasing. The risk that a design will fail either functional performance or reliability goals grows for each generation. One increasingly popular trade-off addresses a balance between thermal compliance and signal integrity. Components with high […]

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September 1, 2008

Product development efficiency through ECAD-MCAD collaboration

In May 2008, the ProSTEP iViP Association released an agreed data schema and communication protocol to enhance collaboration between electrical and mechanical CAD tools (ProSTEP iViP Recommendation ECAD/MCAD, PSI 5). The article sets out the need for the new standards and how they deliver greater design effi ciencies than existing technologies, such as the IDF […]

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March 1, 2006

Which ADC architecture is right for your application – Part Two

Selecting the proper ADC can appear a formidable task. A direct approach is to go to the selection guides and parametric search engines. Enter the sampling rate, resolution, power supply voltage, and other properties. Click ‘find’. But can one approach the task with greater understanding — particularly of the main architectures — and get better […]

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December 1, 2005

Which ADC architecture is right for your application – Part One

Introduction Selecting the proper ADC can appear a formidable task, considering the thousands on the market. A direct approach is to go to the selection guides and parametric search engines. Enter the sampling rate, resolution, power supply voltage, and other properties. Click ‘find’. And hope for the best. But it’s usually not enough. How does […]

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