Assembly & Integration

April 28, 2014

Protecting IP in a collaborative signoff environment

The encryption chain for today's highly collaborative designs needs to be managed with care.
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March 24, 2014

Prototyping solutions for validation of complex ASIC IP

An in-depth look at the role of FPGA-based prototyping and the validation use cases it offers when integrating complex blocks.
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January 7, 2014
Neil Songcuan is a senior product marketing manager, responsible for the FPGA-based Prototyping Solution at Synopsys.

Using HAPS to streamline IP to SoC integration

The HAPS prototyping system can help designers integrate IP into SoCs more quickly.
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December 16, 2013
Mick Posner is Director of Product Marketing for Synopsys' FPGA-Based Prototyping Solutions.

Consistency key to gaining the advantages of IP integration

Consistency is vital to IP integration strategies that rely on developing an SoC using a hierarchy of FPGA-based prototypes.
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October 23, 2013

FPGA-based prototyping to validate the integration of IP into an SoC

A case study describing validation of the integration of USB3.0 and USB2.0 interface IP that illustrates broader challenges FPGA-based prototyping presents.
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September 16, 2013

The USB 3.0 Link Layer

A look at the way in which the USB 3.0 Link Layer manages the port-to-port flow of data between the host and the device.
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September 16, 2013

USB 3.0 system overview

An overview of the USB 3.0 architecture, covering the USB Host, USB Device(s) and USB Interconnect, as well as the related receptacles, plugs and cables.
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September 16, 2013

USB 3.0 protocol layer – part 1

A first look at the role of the protocol layer in USB 3.0.
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September 16, 2013

The USB 3.0 Functional Layer

A look at the USB 3.0 functional layer, an application layer and system software on the host side, and a logical function and device on the device side.
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September 16, 2013

USB 3.0 protocol layer – part 2

A look at the role of four types of transaction in the USB 3.0 protocol layer: bulk, control, interrupt and isochronous.
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