design integrity

January 19, 2023

Putting it all together to accelerate 3D IC design

Learn how connectivity management solutions help you manage the multiple formats in which 3D IC components are delivered.

Article | Topics: PCB - Design Integrity, - EDA Topics, EDA - IC Implementation, - PCB Topics, PCB - System Codesign | Tags: 2.5D, 3D, advanced packaging, chiplet, connectivity management, design integrity, Design Management, file format, interposer | Organizations: Siemens EDA