June 2006

June 1, 2006

Design and manufacturing unite to tackle process variability

Analyses made by semiconductor manufacturers have demonstrated that maintaining pattern fidelity is critical, and that this task faces increasing limitations at the 65nm process node and below. At these technology nodes, even the most advanced resolution enhancement technologies (RET) have a difficult time with certain layout topologies.  When the impact of this is observed across […]

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June 1, 2006

Addressing the design closure crisis

Why are more chips late to market and cost three times more to design at 90-nanometer (nm) than at 130nm? Today’s ASSPs and ASICs are huge, approaching one billion transistors, with clock speeds exceeding 1-GHz. Engineers struggle to manage the complexity of devices that achieve these levels of performance and size. A natural reaction to […]

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June 1, 2006

Deploying the right tools for mixed signal verification

Engineers on the leading edge of nanometer design are dealing with physical effects that change the way mixed-signal ICs are verified – in timing, power, reliability and yield. With the IC verification effort accounting for 60-80% of the development cycle, choosing and deploying the right mixed-signal verification solution can significantly improve productivity and the return […]

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