March 2007

March 1, 2007

Scan infrastructure and environment for enhanced at-speed ATPG

A major issue faced by SoC design teams adopting 90nm and 65nm process nodes is the increase in yield fall-out. At 90nm it is estimated that 30% of yield fall-out is due to performance and signal integrity issues. As a result, accurate and cost effective at-speed manufacturing test and characterization has become evermore critical to […]

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March 1, 2007

Revealing the hidden cost of performance for physical verification

The increasingly onerous nature of physical verification at today’s nanometer process geometries requires the regular benchmarking of appropriate tools, if designs are to be realized in a cost-effective manner. However, the criteria for such benchmarking are all too often limited to relatively simplistic notions of ‘performance’. The article explains that the real cost of physical […]

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March 1, 2007

Re-evaluating the flow for package-aware chip design

Chip and package design are all too often still seen as separate stages in the design process. In today’s nanometer age and with the growing use of techniques such as system-in-package, this lack of integration can have catastrophic results. Package designers frequently encounter overly complex and un-routable silicon that requires multiple iterations to fix. Problems […]

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