Collaboration across the electrical and mechanical domains leverages more tightly integrated and highly featured tools with richer data formats for greater accuracy and shorter time-to-market.
Moving up to PCIe 5.0 speeds demands rethinking everything from silicon design through choice of PCB material and connectors up to track layout and validation.
The COM methodology is being extended and more widely adopted across high-speed designs thanks to deeper tool integration.
Seven core considerations will help you realize your PCB for the Internet of Things more effectively.
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