September 2010

September 10, 2010

Overcoming manufacturing challenges in MEMS

Microelectromechanical systems (MEMS) manufacturing continues to be dogged by a technologically and economically inefficient landscape where too many products demand their own bespoke processes and packages. However, the last three years have seen third-party foundries gain more influence over the sector, bringing greater demands for reuse and DFM considerations, earlier in the design flow. The [...]
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September 10, 2010

Symbolic simulation speeds timing closure

Timing closure is a key challenge for today’s complex system-on-chip designs. Static timing analysis (STA) tools automatically analyze signal paths in a design and identify timing-critical paths that limit the clock frequency that can be achieved. Paths that can never be functionally activated or that require multiple cycles for correct operation can be identified as [...]
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September 10, 2010

Parallel simulation of SystemC TLM 2.0 compliant MPSoCs

Simulation speed is a key issue for the virtual prototyping (VP) of multiprocessor system-on-chips (MPSoCs). The SystemC transaction level modeling (TLM) 2.0 scheme accelerates simulation by using interface method calls (IMC) to implement communication between hardware components. Acceleration can also be achieved using parallel simulation. Multicore workstations are moving into the computing mainstream, and symmetric [...]
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September 10, 2010

Hypervisors and the Power Architecture

The use of multicore processors is on the rise to meet inexorable demand for increasingly sophisticated functionality in embedded systems. Hardware virtualization technology provides a complementary and game-changing approach to maximizing the utility of that extra silicon horsepower. The Power Architecture has included hardware virtualization support since 2001 in its server-based instruction set architecture (ISA). [...]
September 10, 2010

Beyond the system

This issue analyzes two of the most dynamic markets in electronics: embedded systems and microelectromechanical systems (MEMS). And both articles tell a familiar tale.
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September 10, 2010

Designing a PCB for power integrity

Signal integrity (SI) issues have been around for a while, the result of ever-faster edge rates. Both SI and PI problems manifest themselves as data errors. Indeed, PI problems are often misdiagnosed as SI problems. As such, an understanding of power delivery issues is essential to the success of any board project, as is a [...]
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